LiMG holds a B.Sc. in Condensed Matter Physics from Nanjing University and a Ph.D. in Electrical and Electronic Engineering from the University of Hong Kong. In December 2020, he joined the faculty of the Hong Kong University of Science and Technology as an Assistant Professor at the Division of Integrative Systems and Design and the Department of Electronic and Computer Engineering. He has held several leadership positions, including Chair of the IEEE Hong Kong Magnetics Chapter (2021-2022) and Vice-Chair of the IEEE Hong Kong EDSSC Joint Chapter (2020-2022). Additionally, he serves as an Associate Editor of IEEE ACCESS and an Associate Director of the Research Center on Smart Manufacturing at HKUST.

李桂君于南京大学获得凝聚态物理学学士学位，于香港大学电子与电气工程获得博士学位。他于2020年12月加入香港科技大学综合系统与设计学部和电子与计算机工程系，担任助理教授。他曾担任IEEE香港磁学分会主席（2021-2022）和IEEE香港EDSSC联合分会副主席（2020-2022）。目前，他还担任IEEE ACCESS副编辑和香港科技大学智能制造研究中心副主任